MIL-C-55302 & BS-9525-F0033

Excellent mechanical and environmental characteristic

2mm pitch footprint

Light weight & space saving

Mixed-Layout and higher density: high, low frequency or high power

Board to board, board to wire & wire to wire connections

Full jackscrew mechanism: rack, floating or locked

Built-in screwjacks for high vibration

Connector housing marking for full traceability

Resistance to solvents, radiations & oxygen free

Reflow solder process compatible (+260°C)

Allows infrared, wave or vapour phase soldering

RoHS, REACH and whiskers free

Service: harnessing, backpotting...