The current capacity of a connector is never a fixed value. It changes with temperature, contact interface condition, and the mechanical stresses applied to the system. For engineers working on compact electronic architectures, interconnect sizing quickly becomes a key factor for long-term reliability.
How can you ensure every contact delivers reliable performance without overheating in real operating conditions?
At Nicomatic, we support this critical design phase with our internal laboratory, able to run application-specific current tests. For simple (non-hybrid) configurations, we also offer our online Current Capacity Calculator.
This tool assists design teams by estimating the maximum admissible current per contact according to connector series, number of lines, and operating temperature.
It also helps anticipate thermal runaway. As temperature increases, contact resistance rises, which generates more heat. In extreme cases, this can damage or deform the connector.
👉Try our free online Current Capacity Calculator now. Click here!
Measured data, not assumptions
All values integrated into the calculator come from tests performed in our internal laboratory. Each curve reflects actual behaviour observed on Nicomatic connectors in controlled conditions.
Design teams can rely on verified data to establish their derating strategy. They can also request the associated test reports to support justification or qualification files.
When projects involve hybrid layouts, specific surface treatments, particular load cycles, or elevated ambient temperatures, our laboratory provides custom current-carrying tests that accurately reproduce the constraints of your application.
These tests may include contact resistance monitoring, temperature rise evaluation, combined current and vibration testing, or environmental conditioning.
Reduce Risks Early in the Design Phase
The calculator offers a fast and reliable baseline for the initial sizing phase. Laboratory testing then enables a deeper validation once the architecture is defined. Together, they minimise thermal risks, optimise connector selection, and secure performance from prototype to qualification.