The densification of electronic boards is pushing mechanical architectures to their limits. With FPGAs and processors demanding ever more I/O and higher speeds, internal connectors (Mezzanine and Backplane) have become the focal point of critical reliability challenges.
For the system architect, the equation is complex: how can pitch be reduced to save space without increasing the risk of failure under vibration?
Here is how Matr’YX and VITA 66 connectors technically address these constraints.
1. The Mezzanine Challenge: Securing a 1 mm Pitch with Matr’YX
Moving to high density in a board-to-board stack-up is risky in harsh environments: standard connectors often suffer from micro-interruptions caused by contact resonance.
The Matr’YX technical response:
This BGA (Ball Grid Array) connector has been specifically designed to eliminate the risk of signal interruption.
4-point contact architecture: Unlike a single-beam contact, each Matr’YX pin features a dedicated geometry providing four simultaneous contact points. This mechanical redundancy guarantees perfect electrical continuity, even under 30 g vibrations.
Density and Speed: With more than 70 contacts/cm² and compatibility up to 25 Gbps (PAM-4), it enables I/O densification without throttling modern processors.
Integration flexibility: Its design supports variable stack heights (from 5.5 mm to 14.5 mm), giving engineers valuable freedom for thermal management.
👉 View the Matr’YX connector technical data sheet now. Click here!
2. The Backplane Challenge: Robust VPX Optics with VITA 66
Within the VPX ecosystem, routing optical fiber to the backplane is essential—but blind-mate connections remain critical: misalignment can lead to optical degradation or failure.
The technical response of Nicomatic VITA 66 modules:
Our modules, qualified to VITA 66.1 and 66.4, are engineered to maximize throughput on the backplane.
The housing design accommodates up to two standard MT ferrules, concentrating 48 optical channels in a single module—an architecture purpose-built to solve the massive bandwidth equation.
👉 Discover our fibre optic ecosystem. Click here!
The success of a high-density architecture depends on the robustness of these invisible interfaces.
With Matr’YX for board stacking and VITA 66 for the backplane, you gain qualified solutions to push the limits of SWaP without compromising your safety margins.