One of the major and ongoing challenges for embedded electronic system designers is managing both signal transmission and power distribution in increasingly confined environments.
To meet these extreme SWaP (Size, Weight, and Power) requirements without compromising reliability, Nicomatic offers high-performance mixed interconnect solutions. Today, we are highlighting two key architectures designed to address this challenge: the CMM 340 and the EMM Mixed HP.
1. CMM 340: Extreme Contact Density
Well known among our users for 3-row architectures (2 mm pitch), the CMM 340 is the ideal solution when the goal is to concentrate the maximum number of mixed contacts in a highly restricted space.
- Optimized density and footprint: While maintaining a similar overall footprint to our CMM 320, the geometry has been redesigned for maximum compactness. This architecture allows the integration of up to 64 power or RF contacts within a single connector, offering quite simply the highest density of special contacts on the market.
- Dedicated configurations: This ultra-dense series is specifically designed for Mixed layouts (HP (High Power)/LF (Low Frequency) or HF (High Frequency)/LF), Multi-mix layouts (LF + HP + HF), or Special versions (Full HP).
- PCB integration: The CMM 340 addresses your routing constraints with straight or 90° angled contacts, available in through-board PCB versions.
2. EMM Mixed HP: 10A Power in a Micro-Connector
Integrating power into ultra-miniaturized environments is often a real challenge. Our EMM micro-connector (1.27 mm pitch), historically recognized for signal transmission, now integrates high power capabilities through its EMM Mixed HP version.
- Unmatched performance at this pitch: The EMM HP can carry up to 10 Amps per contact, combining extreme compactness with a current-carrying capacity that is exceptionally rare for such a small footprint.
Flexible configurations: The EMM is easily available in mixed layouts (signal + power) or special versions (up to 15 power contacts) to match your power distribution requirements.
- Simplified routing: The range includes a wide variety of terminations to fit your architecture, including straight HP through-board PCB contacts, cable versions, and 90° HP contacts.
Whether you need the proven robustness of the CMM at a 2 mm pitch or the extreme micro-interconnect density of the EMM at a 1.27 mm pitch, high-power distribution should no longer be a barrier to increasing the density of your electronic boards.